For over 15 Years, SIX SIGMA has been advancing lead finish and soldering technology for the military, aerospace, and commercial microelectronics component industry. SIX SIGMA is the technical leader and subcontractor of choice for component lead finish conversions, restoration, and ruggedization.

Our team of experienced semiconductor assembly engineers is committed to obtaining component lead finish excellence through the development of innovative manufacturing processes and solutions.

SIX SIGMA: Your Experts in Component Solder Interconnects: Robotic Hot Solder Dip, BGA Ball Attach, Solder Column Attach, Tin-Lead & Lead-Free Conversions; Hermeticity, Solderability, & Cleanliness Testing; Component Level Reliability & Failure Analysis.

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News

May  2007
Press Release: SIX SIGMA Solder Column Technology used in CFEsat
Article from SMT  (External)
Article from Advance Packaging (External)

November  2006
Reinforced Column Grid Array - Actel Space Forum (PDF)

October 2006
Hot Solder Dip and Minimizing Thermal Gradients - IMAPS 2006