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Acoustic Micro-Imaging (AMI)
is used to detect delamination in non-hermetic components. It is a method of
determining hidden internal defects such as voids, delaminations, cracks or
disbonds that are invisible to the naked eye. It is a non-destructive internal
inspection that makes use of high-frequency ultrasound.
An object that has good material
continuity and good bonding between its layers has very little sound
wave obstruction. On the other hand, if an object has defects such as voids,
cracks, porous areas, disbonds or delaminations, then the sound wave is obstructed*.
This obstruction then appears as a contrast in the acoustic image.
Severe delamination can
lead to broken wire bonds. Minor delamination can trap contaminants. which
can cause corrosion, electromigration, conductive-anodic filaments, or other
latent defects.
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