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SIX SIGMA has been providing
Ball Attach and Reballing services to the Military, Aerospace and Commercial
industries for the past 10 years.
For over 10 years, SIX SIGMA has offered Ball
Attach and Reballing Services. We can convert solder sphere composition from
lead-free to tin-lead (Sn63-Pb37 or Sn10-Pb90), or from tin-lead to
lead-free. SIX SIGMA can also reball your customer-returned components so
they can be electrically tested for failure analysis purposes or possible
reuse.
The ball attach and reballing process
consists of three steps – (1) deball, (2) sphere placement, and (3) reflow.
In the deball step, automated sphere removal is performed in a Flexline®
robotic solder dip system, which involves a controlled, gentle, multi-unit
process. The solder spheres and any intermetallics are dissolved and flushed
away by our special zero contact process (which does not use solder wick that can harm
pads).
SIX SIGMA is capable of handling both high
and low-volume production for sphere placement. For high volume production,
our Vanguard automated line is used; while the patented
SolderQuik®
BGA Preform method is utilized for low-volume production. After sphere
placement, the solder spheres are subjected to forced-convection reflow,
where a low component temperature is maintained and the component’s thermal
gradient is minimized. The BGA components are then cleaned and inspected.
SIX
SIGMA offers qualification testing that includes acoustic microscopy, ionic
cleanliness test, and ball shear test.
Checklist
for the customers before sending parts to SIX SIGMA
BGA Reballing for Military & Aerospace
Applications ( JPG)
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Automated High Volume Ball Attach Line
One example of our more than 2000 footprints
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