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Other
Analytical Services
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Metallographic Cross-sectioning
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Metallographic cross-sectioning is
the process of exposing the internal plane of interest of a sample for
detailed examination. The process consists of mounting, sawing, grinding,
polishing, and etching the sample so it can be analyzed using an
optical
microscope. A scanning electron microscope may also be used to verify and
take a closer look at the microstructure that was observed under an
optical
microscope. |
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Optical Microscopy
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An optical
microscope is the most common (and the first to be invented) type of
microscope. It is used to view and inspect sample details that are too
small to be viewed with the naked eye. It is easy to use, and samples can
be analyzed in air or water. The images are in natural color with
magnifications of up to 100 to 1000 times. However, it does not have the
same depth of focus and resolving power as the SEM. |
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Particle
Impact Noise Detection (PIND) Testing
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PIND testing is used to
detect loose particles inside a device cavity. This test provides a means
of identifying devices that contain particles with sufficient mass that upon
impact with the case, excite the transducer. It is a non-destructive test.
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Applicable
Specifications & Standards:
JEDEC JEP114, Guidelines for Particle Impact Noise Detection (PIND) Testing,
Operator Training and Certification
MIL-STD-883 Method 2020, Particle Impact Noise Detection (PIND) Test
MIL-STD-750 Method 2052, PIND Test
MIL-STD-202 Method 217, Particle Impact Noise Detection (PIND)
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Sputtering System
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SIX SIGMA utilizes sputter-coater system to coat
non-metallic samples with a thin layer of gold (other target materials
include carbon, gold-palladium, platinum, and silver) to make them
electrically conductive. This enables them to be viewed with a scanning electron
microscope (SEM). This conductive coating inhibits charging, reduces thermal
damage, and enhances secondary electron emission when the sample is examined
under a SEM. |
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