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Solderability testing is used to determine the solderability
of leads and terminations which are normally joined by a soldering operation.
This determination is based on the ability of the terminations to be wetted
by the molten solder. The test provides for accelerated aging (steam
conditioning) in order to simulate the
condition of the components after long-term storage.
Dip and look solderability testing is performed by subjecting
the components to 0-8 hours of steam conditioning. After steam conditioning,
the components terminations are
dipped into the solder in a controlled fashion using a specific activated rosin
flux. After dipping, the components are inspected to the criteria specified.
Surface mount simulation testing is performed by screen printing
a specific solder paste onto a ceramic plate then placing the component onto
the paste, followed by a specific convection reflow profile. Surface mount simulation
testing can be used on all surface mount components including BGA and CGA
which cannot use the dip and look method.
All components can be tested for solderability. SIX SIGMA always considers the test to be destructive.
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